ES Electronic Specialty Gas Adsorption Media uses high-quality activated carbon or activated alumina as the carrier and is refined through impregnation with metal oxides. It is used to remove electronic specialty gases used or released during the production of ultra-large-scale integrated circuits (IC), flat-panel display devices (LCD, LED, OLED), solar cells, and other electronic industries. ES Electronic Specialty Gas Adsorbent features activity, selectivity, and stability, with excellent adsorption and catalytic performance for efficient adsorption and purification of electronic specialty gases. It features a large specific surface area, suitable pore structure, high mechanical strength, resistance to high-temperature and high-pressure conditions, resistance to crushing, and long service life.

Composite Gas Adsorbents ESONA/ESONB

General-purpose composite adsorbent media for simultaneous treatment of mixed corrosive exhaust gases such as VOC, NOₓ, F₂, Cl₂, and ClF₃, suitable for multi-component exhaust gas treatment in semiconductor, display, and photovoltaic applications.
Applicable gas:
• ESONA (Ambient-Temperature): Used with ambient-temperature dry exhaust gas adsorption systems
• ESONB (For High Temperature): Used with integrated high-temperature decomposition + adsorption exhaust gas equipment

Acid Gas Adsorbent ESTWC/ESTWF/ESTWH

Specialized chemisorption consumables designed for halogenated acidic corrosive exhaust gases generated during semiconductor processes, efficiently neutralizing strongly acidic halogen gases such as HCl, HF, and Cl₂. Filled into dry purification equipment for etching and cleaning processes.
Applicable gas: HCl, Cl₂, F₂, HF, HBr, BF₃, BCl₃, SiF₄

Ambient-Temperature Catalytic Adsorbent ESTHA/ESTHB

Ambient-temperature catalytic adsorption integrated media designed for combustible and strongly oxidative exhaust gases such as CO, O₃, H₂, and SiH₄; no external heating is required, and the exhaust gases can be catalytically decomposed and immobilized at ambient temperature for safe treatment of flammable and explosive process gases.
Applicable gas: CO, O₃, H₂, SiH₄

Ammonia & Sulfur Series Adsorbent ESFOA/ESFOS/ESFOM

Targeted chemisorption media for treating alkaline ammonia-containing, sulfide, and nitrogen oxide exhaust gases from production lines; harmful gases are stably captured through chemical reactions, suitable for dry adsorption towers and equipment-level chemical filters.
Applicable gas:
• ESFOA: NH₃, TMA, DEA (alkaline ammonia & organic amine gas)
• ESFOS: H₂S, H₂Se, SO₂ (sulfide waste gas)
• ESFOM: N₂O, NF₃, NO, NO₂ (nitrogen oxides)

Alkane Gas Adsorbent ESFIA/ESFIB/ESFIH

Specialized chemisorption media for highly toxic alkane gases, designed for highly flammable, explosive, and toxic process gases such as PH₃, AsH₃, SiH₄, DCS, and TCS. It irreversibly immobilizes toxic substances in depth, providing an exceptionally high level of safety, and is specifically intended for dry treatment of exhaust gases from wafer ion implantation and photovoltaic phosphidation processes.
Applicable gas: PH₃, AsH₃, SiH₄, H₂Se, H₂S, SO₂, DCS, TCS

Organic Gas Adsorbent ESSIA/ESSIB/ESSIM

A physical + chemical composite adsorption structure designed to treat metal-organic precursors and hydrocarbon VOC exhaust gases from CVD/ALD processes, simultaneously adsorbing silicon-source gases, metal-organic vapors, and hydrocarbon exhaust gases, suitable for dry filter modules and exhaust gas adsorption towers.
Applicable gas: TCS, TEOS, TMA, TMB, DEZ, NF₃, CH₄, C₂H₄, VOCₓ

High-Temperature Greenhouse Gas Adsorbent ESPFC/ESNF3/ESSF6

High-temperature specialized chemisorption media designed for strongly persistent perfluorinated greenhouse gas emissions from semiconductor processes. It achieves efficient decomposition and adsorption only within the corresponding high-temperature range, providing harmless treatment of PFC, NF₃, and SF₆ generated during chamber cleaning, and is specifically used as filling media for high-temperature decomposition exhaust gas equipment.
Applicable Gas & Operating Temperature by Model：
• ESPFC: Mixed PFC gas (C₄F₆, C₄F₈, CF₄, CHF₃, CH₂F₂), operating temperature: 700-800℃
• ESNF3: Nitrogen trifluoride (NF₃), operating temperature: 350-450℃
• ESSF6: Sulfur hexafluoride (SF₆), operating temperature: 550-700℃