ES electronic special gas adsorption media are refined by impregnating metal oxides with high-quality activated carbon or activated alumina as carriers. They are applied to remove electronic special gases consumed or exhausted during the production of ULSI, flat panel displays (LCD, LED, OLED), solar cells and other electronic products.
The adsorbents feature three core merits: high activity, excellent selectivity and outstanding stability, delivering superior adsorption and catalytic performance for efficient electronic gas purification. They possess large specific surface area, optimized pore structure and high mechanical strength, capable of withstanding high temperature and high pressure without pulverization, with extended service life.

Integrated Gas Adsorbent ESONA/ESONB

Universal composite adsorbent for mixed corrosive waste gas including VOC, NOₓ, F₂, Cl₂, ClF₃, suitable for multi-component exhaust purification in semiconductor, display and PV production lines.
Treated gas:
• ESONA (For Normal Temperature): Ambient temperature dry scrubber system
• ESONB (For High Temperature): Integrated high-temperature decomposition & adsorption exhaust equipment

Acid Gas Adsorbent ESTWC/ESTWF/ESTWH

Special chemical adsorbent for halogenated acidic corrosive exhaust in semiconductor & FPD factories. It efficiently neutralizes strong acidic halogen gases such as HCl and HF, used as filler for dry purification devices in etching and cleaning processes.
Treated gas: HCl, Cl₂, F₂, HF, HBr, BF₃, BCl₃, SiF₄

Normal Temperature Catalytic Adsorbent ESTHA/ESTHB

Integrated catalytic adsorption material for flammable and oxidizing exhaust like CO, O₃, H₂, SiH₄. No external heating required; catalytic decomposition and gas immobilization can be realized at room temperature to safely handle flammable and oxidizing process gas.
Treated gas: CO, O₃, H₂, SiH₄

Ammonia & Sulfur Series Adsorbent ESFOA/ESFOS/ESFOM

Targeted chemical adsorbent for alkaline ammonia-containing waste gas, sulfides and nitrogen oxides from manufacturing lines. Hazardous gases are stably captured via chemical reactions, compatible with dry adsorption towers and tool-side chemical filters.
Treated gas:
• ESFOA: NH₃, TMA, DEA (alkaline ammonia & organic amine gas)
• ESFOS: H₂S, H₂Se, SO₂ (sulfide waste gas)
• ESFOM: N₂O, NF₃, NO, NO₂ (nitrogen oxides)

Toxic Alkane Gas Adsorbent ESFIA/ESFIB/ESFIH

Special chemical adsorbent for highly toxic, flammable and explosive process gas such as PH₃, AsH₃, SiH₄, DCS, TCS. Toxic substances are thoroughly immobilized via irreversible reactions with superior safety, exclusively for dry exhaust treatment of wafer ion implantation and photovoltaic phosphating processes.
Treated gas: PH₃, AsH₃, SiH₄, H₂Se, H₂S, SO₂, DCS, TCS

Organic Gas Adsorbent ESSIA/ESSIB/ESSIM

Combined physical & chemical adsorption material for metal-organic precursors and hydrocarbon VOC waste gas generated from CVD & ALD processes. It simultaneously adsorbs silicon sources, metal organic vapor and hydrocarbon exhaust, matching dry filter modules and adsorption towers.
Treated gas: TCS, TEOS, TMA, TMB, DEZ, NF₃, CH₄, C₂H₄, VOCₓ

High-Temperature Greenhouse Gas Adsorbent ESPFC/ESNF3/ESSF6

High-temperature exclusive chemical adsorbent for potent perfluorinated greenhouse gases in semiconductor industry. Efficient decomposition and adsorption only occur under matched high-temperature conditions to harmlessly treat PFC, NF₃, SF₆ exhausted from chamber cleaning, as dedicated filler for high-temperature decomposition scrubbers.
Treated Gas & Operating Temperature by Model：
• ESPFC: Mixed PFC gas (C₄F₆, C₄F₈, CF₄, CHF₃, CH₂F₂), operating temperature: 700-800℃
• ESNF3: Nitrogen trifluoride (NF₃), operating temperature: 350-450℃
• ESSF6: Sulfur hexafluoride (SF₆), operating temperature: 550-700℃